công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

385LP4E bảng dữ liệu(PDF) 3 Page - Hittite Microwave Corporation

tên linh kiện 385LP4E
Giải thích chi tiết về linh kiện  MMIC VCO w/ BUFFER AMPLIFIER, 2.25 - 2.5 GHz
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
nhà sản xuất  HITTITE [Hittite Microwave Corporation]
Trang chủ  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

385LP4E bảng dữ liệu(HTML) 3 Page - Hittite Microwave Corporation

  385LP4E Datasheet HTML 1Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 2Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 3Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 4Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 5Page - Hittite Microwave Corporation 385LP4E Datasheet HTML 6Page - Hittite Microwave Corporation  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
9
9 - 16
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
Vcc
+3.5 Vdc
Vtune
0 to +11V
Channel Temperature
135 °C
Continuous Pdiss (T = 85°C)
(derate 6.28 mW/°C above 85°C)
565 W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Typical Supply Current vs. Vcc
Note: VCO will operate over full voltage range shown above.
Vcc (V)
Icc (mA)
2.75
28
3.0
35
3.25
41
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC385LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H385
XXXX
HMC385LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H385
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
PCB LAND PATTERN
MMIC VCO w/ BUFFER
AMPLIFIER, 2.25 - 2.5 GHz
v02.0705
HMC385LP4 / 385LP4E



Html Pages

1 2 3 4 5 6


bảng dữ liệu tải về

Go To PDF Page


Link URL



Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không?  [ DONATE ] 

Alldatasheet là   |   Quảng cáo   |   Liên lạc với chúng tôi   |   Chính sách bảo mật   |   Liên kết đến bảng dữ liệu    |   Trao đổi link   |   Tìm kiếm theo nhà sản xuất
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com