TMS320VC33 datasheet(47/53 Pages) TI2

47 / 53 page

PREFIX

SMJ

320

VC 33 GNM

SMX = experimental device

TMP = prototype device

TMS = qualified device

SMJ = MIL-PRF-38535 (QML)

SMQ= QML Plastic device

SM = Commericial processing

DEVICE FAMILY

320 = TMS320 Family

TECHNOLOGY

TEMPERATURE RANGE

M = Military

C = CMOS

E = CMOS EPROM

F = CMOS Flash EEPROM

LC = Low-Voltage CMOS (3.3 V)

VC = Low-Voltage CMOS [3 V (2.5 V

or 1.8 V core)]

UC= Ultra Low-Voltage CMOS [1.8 V

(1.5 V core)]

DEVICE

3x DSP:

4x DSP:

6x DSP:

6201 6201

6701 6211

PACKAGE TYPE

(A)

HFG = 164-pin ceramic quad flat package (QFP)

GNL = 144-pin ceramic ball grid array (BGA) hermetic

GNM = 144-pin ceramic BGA, non-hermetic

SPEED

150 = 150 MFLOPS

150

SM320VC33, SMJ320VC33

www.ti.com

SGUS034F – FEBRUARY 2001 – REVISED JUNE 2015

QFP = Quad flat package

LQFP = Low-profile quad flat package

BGA = Ball grid array

Figure 39. TMS320 DSP Device Nomenclature

10.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 10. Related Links

TECHNICAL

TOOLS &

SUPPORT &

PARTS

PRODUCT FOLDER

SAMPLE & BUY

DOCUMENTS

SOFTWARE

COMMUNITY

SM320VC33

Click here

SMJ320VC33

Click here

10.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

Submit Documentation Feedback

Product Folder Links: SM320VC33 SMJ320VC33

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