6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage, VS = (V+) – (V–)

40

V

Input voltage

(V–)

(V+)

V

Differential input voltage

–30

30

V

ISC

Output short circuit(2)

Continuous

TJ

Junction temperature

150

°C

TSTG

Storage temperature

–65

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage, VS = (V+) – (V–)

Single supply

6

30

36

V

Dual supply

±3

±15

±18

TA

Ambient temperature

–40

85

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA177

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

160.0

100.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report

OPA177

SBOS008A – SEPTEMBER 2000 – REVISED SEPTEMBER 2023

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