LMH6505

SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance (3)

Human Body Model

2000V

Machine Model

200V

Input Current

±10 mA

Output Current (4)

120 mA

Supply Voltages (V+ - V−)

12.6V

Voltage at Input/ Output pins

V+ +0.8V, V−

−0.8V

Storage Temperature Range

−65°C to 150°C

Junction Temperature

150°C

Soldering Information:

Infrared or Convection (20 sec)

235°C

Wave Soldering (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum output current (IOUT) is determined by device power dissipation limitations or value specified, whichever is lower.

Operating Ratings

(1)

Supply Voltages (V+ - V−)

7V to 12V

Temperature Range (2)

−40°C to +85°C

Thermal Resistance:

(

θJC)

(

θJA)

8 -Pin SOIC

60

165

8-Pin VSSOP

65

235

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

2

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