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LM2611AMF/NOPB bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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LM2611AMF/NOPB bảng dữ liệu(HTML) 3 Page - Texas Instruments |
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3 / 29 page ![]() 1 2 3 NFB SW GND 5 VIN 4 SHDN LM2611 www.ti.com SNOS965J – JUNE 2001 – REVISED DECEMBER 2015 5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View Pin Functions PIN TYPE(1) DESCRIPTION NO. NAME 1 SW A Drain of internal switch. Connect at the node of the input inductor and Cuk capacitor. 2 GND GND Analog and power ground. 3 NFB A Negative feedback. Connect to output via external resistor divider to set output voltage. 4 SHDN I Shutdown control input. VIN = Device on. Ground = Device in shutdown. Analog and power input. Filter out high frequency noise with a 0.1-µF ceramic capacitor 5 VIN PWR placed close to the pin. (1) A = Analog, I = Input, GND = Ground, PWR = Power 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage, VIN 14.5 V SW voltage –0.4 36 V NFB voltage –6 0.4 V SHDN voltage –0.4 14.5 V Maximum junction temperature 125 °C Power dissipation (2) Internally limited Lead temperature 300 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V(ESD) Electrostatic discharge V Machine Model (MM)(3) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. (3) The machine model is a 200-pF capacitor discharged directly into each pin. Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2611 |
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