7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 Mechanical Dimensions

C

0.35

2X

0.16

0.14

2X

0.26

0.24

0.36 MAX

0.325

0.26

0.24

0.51

0.49

0.175

0.65

A

1.04

0.96

B

0.64

0.56

PIN 1 INDEX AREA

SEATING PLANE

1

2

0.015

C B

A

0.015

C A

B

3

A.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME

Y14.5M.

B.

This drawing is subject to change without notice.

C.

This package is a Pb-free bump design. Bump finish may vary. To determine the exact finish, refer to the device data sheet or contact a

local TI representative.

CSD17381F4

SLPS411G – APRIL 2013 – REVISED JANUARY 2022

www.ti.com

8

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