5 Specifications

5.1 Absolute Maximum Ratings(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input diode current

For VI < -0.5 V or VI > VCC + 0.5 V

±20

mA

IOK

Output diode current

For VO < -0.5 V or VO > VCC + 0.5 V

±20

mA

IO

Drain current, per output

For -0.5 V < VO < VCC + 0.5 V

±25

mA

IO

Output source or sink current per

output pin

For VO > -0.5 V or VO < VCC + 0.5 V

±25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature range

-65

150

°C

Lead temperature (Soldering 10s)(SOIC - lead tips only)

300

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC Types

2

6

V

HCT Types

4.5

5.5

V

VI, VO

Input or output voltage

0

VCC

V

tt

Input rise and fall time

2V

1000

ns

4.5V

500

6V

400

TA

Temperature range

–55

125

℃

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

N (PDIP)

UNIT

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

(1)

73

67

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD54HC166, CD54HCT166, CD74HC166, CD74HCT166

SCHS157D – FEBRUARY 1998 – REVISED FEBRUARY 2022

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