TUSB2077A

SLLS414F – MARCH 2000 – REVISED AUGUST 2015

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7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3

3.3

3.6

V

VI

Input voltage, TTL/LVCMOS(1)

0

VCC

V

VO

Output voltage, TTL/LVCMOS(2)

0

VCC

V

VIH(REC)

High-level input voltage, signal-ended receiver

2

VCC

V

VIL(REC)

Low-level input voltage, signal-ended receiver

0.8

V

VIH(TTL)

High-level input voltage, TTL/LVCMOS(1)

2

VCC

V

VIL(TTL)

Low-level input voltage, TTL/LVCMOS(1)

0

0.8

V

TA

Operating free-air temperature

0

70

°C

R(DRV)

External series, differential driver resistor

22

Ω

f(OPRH)

Operating (dc differential driver) high speed mode

12

Mb/s

f(OPRL)

Operating (dc differential driver) low speed mode

1.5

Mb/s

VICR

Common mode, input range, differential receiver

0.8

2.5

V

tt

Input transition times, TTL/LVCMOS (1)

0

25

ns

TJ

Junction temperature(3)

0

115

°C

(1)

Applies for input and bidirectional buffers.

(2)

Applies for output and bidirectional buffers.

(3)

These junction temperatures reflect simulated conditions. Absolute maximum junction temperature is 150°C. The customer is

responsible for verifying junction temperature.

7.4 Thermal Information

TUSB2077A

THERMAL METRIC(1)

PT (LQFP)

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

66.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

21.1

°C/W

RθJB

Junction-to-board thermal resistance

37.8

°C/W

ψJT

Junction-to-top characterization parameter

0.9

°C/W

ψJB

Junction-to-board characterization parameter

31.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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