BUF22821

SBOS399D

– JUNE 2007 – REVISED JULY 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

PRODUCT

PACKAGE

PACKAGE DESIGNATOR

PACKAGE MARKING

BUF22821

HTSSOP-38

DCP

BUF22821

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

BUF22821

UNIT

Supply Voltage, VS

+22

V

Supply Voltage, VSD

+6

V

Digital Input Terminals, SCL, SDA, AO, BKSEL: Voltage

–0.5 to +6

V

Digital Input Terminals, SCL, SDA, AO, BKSEL: Current

±10

mA

Analog Input Terminals, STATINL, STATINH: Voltage

–0.5 to VS + 0.5

V

Analog Input Terminals, STATINL, STATINH: Current

±10

mA

Output Short-Circuit(2)

Continuous

Operating Temperature

–40 to +95

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

+125

°C

Human Body Model

4000

V

ESD Ratings

Charged-Device Model

1000

V

Machine Model

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

Short-circuit to ground, one channel at a time.

2

Copyright

© 2007–2011, Texas Instruments Incorporated