www.ti.com

EXAMPLE BOARD LAYOUT

28X (0.5)

(1.3)

(1.3)

(R0.05) TYP

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

32X (0.6)

32X (0.24)

(4.8)

(4.8)

(3.1)

(3.1)

(

0.2) TYP

VIA

WQFN - 0.8 mm max height

RTV0032A

PLASTIC QUAD FLATPACK - NO LEAD

4224386/B 04/2019

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

SYMM

SEE SOLDER MASK

DETAIL

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 15X

1

8

9

16

17

24

25

32

33

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS