TRIPSET0

TRIPSET1

GND

OUT

VS

HYSTSET

Heat Source

0.1 µF

VIA to Power Ground Plane

Ground Plane for

Thermal

Coupling to Heat

Source

Supply Voltage

Output

10 k

Time (5 µs/div)

OUT

VS

Time (10 ms/div)

OUT

VS

11

TMP302

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SBOS488E – JUNE 2009 – REVISED DECEMBER 2018

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Typical Application (continued)

Figure 12. TMP302A Power-On Response,

TA Less than 50°C

Figure 13. TMP302A Power-On Response,

TA Greater than 50°C

9 Power Supply Recommendations

The TMP302 family of devices is designed to operate from a single power supply within the range 1.4 V and 3.6

V. No specific power supply sequencing with respect to any of the input or output pins is required. The TMP302

family of devices is fully functional within 35 ms of the voltage at the VS pin reaching or exceeding 1.4 V.

10 Layout

10.1 Layout Guidelines

Place the power supply bypass capacitor as close as possible to the VS and GND pins. The recommended value

for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or high-

impedance power supplies. Place a 10-kΩ pullup resistor from the open drain OUT pin to the power supply pin

VS.

10.2 Layout Example

Figure 14. Layout Example