TLC5602C, TLC5602M

VIDEO 8-BIT DIGITAL-TO-ANALOG CONVERTERS

SLAS023D – FEBRUARY 1989 – REVISED JANUARY 2002

8

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

The following design recommendations benefit the TLC5602 user:

D Physically separate and shield external analog and digital circuitry as much as possible to reduce system

noise.

D Use RF breadboarding or RF printed-circuit-board (PCB) techniques throughout the evaluation and

production process.

D Since ANLG GND and DGTL GND are not connected internally, these terminals need to be connected

externally. With breadboards, these ground lines should connect to the power-supply ground through

separate leads with proper supply bypassing. A good method is to use a separate twisted pair for the analog

and digital supply lines to minimize noise pickup.

Use wide ground leads or a ground plane on the PCB layouts to minimize parasitic inductance and

resistance. The ground plane is the better choice for noise reduction.

D ANLG VDD and DGTL VDD are also separated internally, so they must connect externally. These external

PCB leads should also be made as wide as possible. Place a ferrite bead or equivalent inductance in series

with ANLG VDD and the decoupling capacitor as close to the device terminals as possible before the ANLG

VDD and DGTL VDD leads are connected together on the board.

D Decouple ANLG VDD to ANLG GND and DGTL VDD to DGTL GND with a 1-µF and 0.01-µF capacitor,

respectively, as close as possible to the appropriate device terminals. A ceramic chip capacitor is

recommended for the 0.01-

µF capacitor.

D Connect the phase compensation capacitor between COMP and ANLG GND with as short a lead-in as

possible.

D The no-connection (NC) terminals on the small-outline package should be connected to ANLG GND.

D Shield ANLG VDD, ANLG GND, and A OUT from the high-frequency terminals CLK and D7–D0. Place

ANLG GND traces on both sides of the A OUT trace on the PCB.