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PIC24FJ256GA705-I/M4. bảng dữ liệu(PDF) 397 Page - Microchip Technology

tên linh kiện PIC24FJ256GA705-I/M4.
Giải thích chi tiết về linh kiện  16-Bit General Purpose Microcontrollers with 256-Kbyte Flash and 16-Kbyte RAM in Low Pin Count Packages
PDF  412 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC24FJ256GA705-I/M4. bảng dữ liệu(HTML) 397 Page - Microchip Technology

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 2016 Microchip Technology Inc.
DS30010118B-page 397
PIC24FJ256GA705 FAMILY
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Contact Pad Spacing
Contact Pitch
MILLIMETERS
0.50 BSC
MIN
E
MAX
8.40
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
1.50
0.30
Microchip Technology Drawing C04-2300-PT Rev A
NOM
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
C1
C2
E
X1
Y1
G
C1
Contact Pad Spacing
8.40
Distance Between Pads
G
0.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SILK SCREEN
12
48



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