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PIC24FJ256GA705-I/M4. bảng dữ liệu(PDF) 394 Page - Microchip Technology

tên linh kiện PIC24FJ256GA705-I/M4.
Giải thích chi tiết về linh kiện  16-Bit General Purpose Microcontrollers with 256-Kbyte Flash and 16-Kbyte RAM in Low Pin Count Packages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC24FJ256GA705-I/M4. bảng dữ liệu(HTML) 394 Page - Microchip Technology

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PIC24FJ256GA705 FAMILY
DS30010118B-page 394
 2016 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
4.70
4.70
MILLIMETERS
0.40 BSC
MIN
E
MAX
6.00
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2442A-M4
NOM
48-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M4) - 6x6 mm Body [UQFN]
1
2
48
C1
Contact Pad Spacing
6.00
Contact Pad to Center Pad (X48)
G1
0.25
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With Corner Anchors and 4.6x4.6 mm Exposed Pad
Pad Corner Radius (X 20)
R
0.10
C1
C2
EV
EV
X2
Y2
X3
Y3
Y1
E
X1
G2
G1
R
Contact Pad to Contact Pad
G2
0.20
Corner Anchor Pad Length (X4)
Corner Anchor Pad Width (X4)
Y3
X3
0.90
0.90
ØV
SILK SCREEN



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