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STM32H523CCU6 bảng dữ liệu(PDF) 200 Page - STMicroelectronics

tên linh kiện STM32H523CCU6
Giải thích chi tiết về linh kiện  Arm Cortex -M33 32-bit MCUTrustZone FPU, 375 DMIPS Arm Cortex -M33 32-bit MCUTrustZone FPU, 375 DMIPS
PDF  228 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H523CCU6 bảng dữ liệu(HTML) 200 Page - STMicroelectronics

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STM32H523xx
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DS14540 Rev 1
Table 119. WLCSP39 - Mechanical data
Symbol
Millimeters
Inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min
Typ
Max
Min
Typ
Max
A(2)
2. The profile height, A, is the distance from the seating plane to the highest point on the package. It is
measured perpendicular to the seating plane.
-
-
0.58
-
-
0.0228
A1(3)
3. A1 is defined as the distance from the seating plane to the lowest point on the package body.
-
0.17
-
-
0.0067
-
A2
-
0.38
-
-
0.0150
-
A3
-
0.025
-
-
0.0010
-
b(4)
4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to datum C.
0.23
0.26
0.28
0.0091
0.0102
0.0110
D2.76 BSC(5)
5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance.
0.1087 BSC
D1
2.000 BSC
0.0787 BSC
E
2.78 BSC
0.1094 BSC
E1
2.078 BSC
0.0818 BSC
e(6)
6. e represents the solder balls grid pitch(es).
0.40 BSC
0.0157 BSC
SD(7)
7. Basic dimensions SD and SE are defining the ball matrix position with respect to datums A and B.
0.200 BSC
0.0079 BSC
SE(7)
0.346 BSC
0.0136 BSC
N39(8)
8. N represents the total number of balls.
aaa(9)
9. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
0.02 BSC
0.0008 BSC
bbb(9)
0.06 BSC
0.0024 BSC
ccc(9)
0.03 BSC
0.0012 BSC
ddd(9)
0.015 BSC
0.0006 BSC
eee(9)
0.05 BSC
0.0020 BSC



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