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MPC5554MZP112 bảng dữ liệu(PDF) 38 Page - NXP Semiconductors

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MPC5554 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
38
3.13.7
eMIOS Timing
Figure 17. eMIOS Timing
3.13.8
DSPI Timing
Table 25. eMIOS Timing 1
1 eMIOS timing specified at: V
DDEH = 3.0–5.25 V and TA = TL to TH.
Spec
Characteristic
Symbol
Min.
Max.
Unit
1
eMIOS input pulse width
tMIPW
4—
tCYC
2
eMIOS output pulse width
tMOPW
1 2
2 This specification does not include the rise and fall times. When calculating the minimum eMIOS pulse width, include the rise
and fall times defined in the slew rate control field (SRC) in the pad configuration register (PCR).
—tCYC
Table 26. DSPI Timing1’ 2
Spec
Characteristic
Symbol
80 MHz
112 MHz
132 MHz
Unit
Min.
Max.
Min.
Max.
Min.
Max.
1
SCK cycle time3, 4
tSCK
24.4 ns
2.9 ms
17.5 ns
2.1 ms
15.2 ns
1.7 ms
—
2
PCS to SCK delay5
tCSC
23
—
15
—
13
—
ns
3
After SCK delay6
tASC
22
—
14
—
12
—
ns
4
SCK duty cycle
tSDC
(tSCK  2)
– 2 ns
(tSCK  2)
+ 2 ns
(tSCK  2)
– 2 ns
(tSCK  2)
+ 2 ns
(tSCK  2)
– 2 ns
(tSCK  2)
+ 2 ns
ns
5
Slave access time
(SS active to SOUT driven)
tA
—
25
—
25
—
25
ns
6
Slave SOUT disable time
(SS inactive to SOUT Hi-Z, or invalid)
tDIS
—
25
—
25
—
25
ns
7PCSx to PCSS time
tPCSC
4—
4
—
4
—
ns
8PCSS to PCSx time
tPASC
5—
5
—
5
—
ns
1
2
eMIOS
output
eMIOS input



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