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STSS-TEMPLATE bảng dữ liệu(HTML) 39 Page - Metcal |
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39 / 64 page  36 Tohelpguaranteeuniformityandhigherprocessyields,theAPR-5000Seriesincorporatespowerful,efficientand fastresponseconvectivetopreflowheaterandbottomdualzonepreheatersforfastrampandtightdelta temperaturecontrolacrossreworkedcomponentanduniformpreheatingacrosssurfaceofthePCB. Theenhancedsoftwareisinstructiveandintuitive,walkingtheengineerthroughthestepsofprocess developmentandthenguidingtheoperatorthroughtheprocessstepstoensureconsistent,repeatableexecution oftheautomaticprofilefunctions.Engineeralsohastheabilitytoassociatetutorialtoindividualprocessfile presentingstep-by-stepinstructionsthatoperatorcanreferencequicklyandeasilyinreal-time. Lead-Free Compatible Astheimplementationoflead-freeassembliesintensifies,theAPR-5000seriesAdvancedPackageRework Systemshavethepower,sizeandsophisticationtomeettherequiredhigher,cost-sensitiveperformancecriteria. Theinnovativesinglereflow/placementheadanddualstagepreheatershelpachieveaconsistentlysmallDeltaT acrosstheboardandthecomponent.Thermaldamageisprecludedduetothesystem'spreciselycontrolled preheater;lead-freeprofilescanbequicklydevelopedviathesystem'sfivethermocouples;andclosed-loop, computercontrolsandintuitivesoftwarehelpoperatorsmaintaintheidealprocessfromstarttofinish. TheAPR-5000SeriesAdvancedPackageReworkSystemsprovidefullconvectioninbothreflowheateranddual pre-heaterstoprovidefastrampandprecise peakreflowtemperaturewithoutthermaldamage tosensitivecomponentsunsuitableforheating above240ºC.Andwithfourheatingzonesand onecoolingzone,thepreciseprofilesneededfor successfulsoldering/desolderingoflead-free packagesareeasilydelivered. TheAPR-5000SeriesAdvancedPackage ReworkSystemsaredistinguishedbyinnovation andflexibility.Thedualstageconvectivepre- heatercanbeswitchedbetweeninnerandouter stagewithinthefourheatingzonesofaprofileto meetthehigherreworkrequirementoflead-free. Higherthermalperformancecanbeachieved, attachingreflownozzlestoboththetopreflow andbottominnerstageheaterssetdirectlyabove andbelowreworkedcomponent.Bottomnozzle hasaddedadvantageinpreventingthermal damagetoadjacentcomponentsonthe undersideofthePCB.Andnewlydesignthermal tweezertopnozzleprovidesintegrated mechanicalactionpickupfordeviceswithlimited surfaceareainsteadofstandardvacuumpickup. |
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