ABSOLUTE MAXIMUM RATINGS

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

V+

OUT_R

OUT_G

OUT_B

V-

V-

SEL

EN

R0

G0

B0

GND

GND

R1

G1

B1

SSOP-16

x2

x2

x2

OPA3875

TopView

SSOP

OPA3875

SBOS341D – DECEMBER 2006 – REVISED AUGUST 2008 ............................................................................................................................................ www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA3875IDBQ

Rails, 75

OPA3875

SSOP-16

DBQ

–45°C to +85°C

OP3875

OPA3875IDBQR

Tape and Reel, 2500

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Over operating temperature range, unless otherwise noted.

OPA3875

UNIT

Power Supply

±6.5

V

Internal Power Dissipation

See Thermal Analysis

Input Voltage Range

±VS

V

Storage Temperature Range

–65 to +125

°C

Lead Temperature (soldering, 10s)

+260

°C

Operating Junction Temperature

+150

°C

Continuous Operating Junction Temperature

+140

°C

ESD Rating:

Human Body Model (HBM)

2000

V

Charge Device Model (CDM)

1500

V

Machine Model (MM)

200

V

PIN CONFIGURATION

2

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Product Folder Link(s): OPA3875