LMP91002

SNIS163B – APRIL 2012 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2) (3)

MIN

MAX

UNIT

Voltage between any two pins

6

V

Current through VDD or VSS

50

mA

Current sunk and sourced by CE pin

10

mA

Current out of other pins(4)

5

mA

Junction temperature(5)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For soldering specifications, see SNOA549.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

All non-power pins of this device are protected against ESD by snapback devices. Voltage at such pins will rise beyond absmax if

current is forced into pin.

(5)

The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PCB.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

Electrostatic

V(ESD)

Charged-device model (CDM), per JEDEC specification JESD22-C101(3)

±1000

V

discharge

Machine Model (MM)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage VS = (VDD - AGND)

2.7

3.6

V

Temperature(1)

–40

85

°C

(1)

The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PCB.

6.4 Thermal Information

LMP91002

THERMAL METRIC(1)

NHL (WSON)

UNIT

14 PINS

RθJA

Junction-to-ambient thermal resistance (2)

44

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PCB.

4

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