| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
LMH2191TMX/NOPB bảng dữ liệu(PDF) 3 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
LMH2191TMX/NOPB bảng dữ liệu(HTML) 3 Page - Texas Instruments |
|
3 / 22 page ![]() LMH2191 www.ti.com SNAS485D – JULY 2010 – REVISED MAY 2013 3.5 V ELECTRICAL CHARACTERISTICS (1) Unless otherwise specified, all limits are specified at TJ = 25°C, VBAT = 3.5V, CBAT = 1µF, COUT = 2.2 µF (2), f SCLK_IN = 26 MHz, IOUT = 1mA, Boldface limits apply at the temperature extremes. Symbol Parameter Condition Min(3) Typ(4) Max(3) Units Supply Current(5)(6) IDD Supply Current Active Mode SCLK_IN = 19.2 MHz; 1.65 both clock outputs toggling; CLOAD 1.4 mA 1.7 CLK1/2 = 0pF; IOUT = 0mA Active Mode SCLK_IN = 19.2 MHz; 4.45 both clock outputs toggling; CLOAD for 3.7 mA 4.50 CLK1/2 = 33.5pF; IOUT = 0mA Active Mode SCLK_IN = 26 MHz, both 2.15 clock outputs toggling, CLOAD for 1.9 mA 2.25 CLK1/2 = 0pF, IOUT=0mA Active Mode SCLK_IN = 26 MHz, both 5.80 clock outputs toggling, CLOAD for 5 mA 5.95 CLK1/2 = 33.5 pF, IOUT=0mA In shutdown. Input clock not active. 0.1 1 µA CLK_REQ1/2=Low In shutdown. Input clock toggling. 0.1 1 uA CLK_REQ1/2=Low CPD Power Dissipation Capacitance CLOAD for CLK1,2 = 0pF, Defined with 23.0 20 pF per CLK output respect to VOUT = 1.8V 24.0 Clock Outputs (CLK1/2) Figure 1, Figure 2 tPD_LH Propagation Delay - Low to High 50% to 50%; 6.1 10.5 CLOAD = 33 pF; measured on CLK1 tPD_HL Propagation Delay - High to Low 50% to 50%; 6.1 10.5 ns CLOAD = 33 pF; measured on CLK1 tSKEW Skew Between Outputs (Either CLK1 to CLK2. 50% to 50% 1.5 3.1 Edge) tRISE Rise Time(7) For CL between 33.5 pF - 50 pF, 20% to 2.1 3.7 5.9 80%; typical value based on 40 pF load ns tFALL Fall Time(7) For CL between 33.5 pF - 50 pF, 20% to 2 3.5 5 80%; typical value based on 40pF load CLK_DC Output Clock Duty Cycle For CL between 33.5 pF - 50 pF 42 50 58 % JitterRMS Additive RMS period Jitter fSCLK-IN= 26 MHz, BW = CLK1 95 fs 100 Hz to 1MHz CLK2 110 (1) Electrical Table values apply only for factory testing (ATE) conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. (2) CBAT, COUT: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. (3) Limits are 100% production tested at 25°C. Limits over temperature range are specified through correlations using statistical quality control (SQC) method. (4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material. (5) Supply current depends on switching frequency and load. (6) Positive current is current flowing into the device. (7) This parameter is specified by design and/or characterization and is not tested in production. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMH2191 |
|
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |