Current

Sources

LSB

Switches

Segmented

Switches

+1.24V Ref.

Latches

10-Bit Data Input

D9...D0

DAC900

FSA

BW

+VD

+VA

AGND

CLK

DGND

REFIN

INT/EXT

IOUT

IOUT

BYP

PD

DAC900-Q1

SBAS505 – JUNE 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

TA

PACKAGE(2)

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–40°C to 105°C

TSSOP – PW

Reel of 2500

DAC900TPWRQ1

DAC900T

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

+VA to AGND

–0.3V to +6V

+VD to DGND

–0.3V to +6V

AGND to DGND

–0.3V to +0.3V

+VA to +VD

–6V to +6V

CLK, PD to DGND

–0.3V to VD + 0.3V

D0-D9 to DGND

–0.3V to VD + 0.3V

IOUT, IOUT to AGND

–1V to VA + 0.3V

BW, BYP to AGND

–0.3V to VA + 0.3V

REFIN, FSA to AGND

–0.3V to VA + 0.3V

INT/EXT to AGND

–0.3V to VA + 0.3V

Junction temperature

+150°C

Storage temperature

+150°C

2

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Product Folder Link(s): DAC900-Q1