LM8262

SNOS975G – MAY 2001 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

(3)

MIN

MAX

UNIT

VIN Differential

+/

−10

V

Output Short Circuit Duration

See (4) (5)

Supply Voltage (V+ - V−)

24

V

Voltage at Input/Output pins

V+ +0.8, V−

−0.8

V

Junction Temperature (6)

+150

°C

Storage temperature range, Tstg

−65

+150

°C

Soldering Information:

Infrared or Convection (20 sec.)

235

°C

Wave Soldering (10 sec.)

260

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(5)

Output short circuit duration is infinite for VS ≤ 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms.

(6)

The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) - TA)/RθJA. All numbers apply for packages soldered directly onto a PC board.

6.2 ESD Ratings

VALUE

UNIT

Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2)

±2000

V(ESD)

Electrostatic discharge(1)

V

Machine Model (MM)(3)

±200

(1)

Human Body Model, 1.5 k

Ω in series with 100 pF. Machine Model, 0 Ω is series with 200 pF.

(2)

JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage (V+ - V−)

2.5

22

V

Operating Temperature Range(1)

−40

+85

°C

(1)

The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) - TA)/RθJA. All numbers apply for packages soldered directly onto a PC board.

6.4 Thermal Information

DGK

THERMAL METRIC(1)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

235

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(max),RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) - TA)/RθJA. All numbers apply for packages soldered directly onto a PC board.

4

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