TLRP2B30DR10FTD datasheet(4/6 Pages) TEC

4 / 6 page

SMD Low Ohmic

– Current Sense Resistors

1773449-4 Rev. B 05/2021

Dimensions in

millimetres unless

otherwise specified

Dimensions Shown for

reference purposes only.

Specifications subject to

change

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go to: www.te.com/help

Item

Requirement

Test Method

Flame Retardance

The following

phenomena cannot

occur during the

experiment:

(1)A flame over 3.0

seconds duration.

(2)An explosion.

(3)A temperature

above 350°C

sustained for over 10

seconds

AEC-Q200-001

Assemble the sample on the test

board, perform functional test

before flame retardant test to

ensure no damage to the sample.

The test environment is 22±5

℃

still air, from 9.0 to 32.0 VDC

(current clamped up to 500A),

increase the voltages at the rate of

1.0 VDC per hour until the end of

the experiment.

Bending Strength

±1.0%

JIS-C-5201-1 4.33

IEC-60115-1 4.33

AEC-Q200-005

Bending width 2mm once for 5

seconds

Terminal Strength (SMD)

Not broken

AEC-Q200-006

Force of 1.8kg for 60 seconds.

Solderability

95% min. coverage

JIS-C-5201-1 4.17

IEC-60115-1 4.17

J-STD-002

245±5°C for 3seconds

Resistance to Soldering

Heat

±0.5%

JIS-C-5201-1 4.18

IEC-60115-1 4.18

MIL-STD-202 Method 210

260±5°C for 10 seconds

Rapid Change of

Temperature

±1.0%

JIS-C-5201-1 4.19

IEC-60115-1 4.19

-55°C to +155°C, 5 cycles

Temperature Cycling

±1.0%

JESD22 Method JA-104

1000 cycles (-55

℃to+125℃,

Dwell 30 minutes, transition time

within 1 minute). Measurement at

24±4 hours after test conclusion.

Low Temperature Storage

±1.0%

IEC60115-1 4.23.4

JIS-C-5201-1 4.23.4

at -55°C for 2hrs

RCWV (Rated Continuous Working Voltage)=

√ P*R or Max. Operati g Voltage

whichever is lower.

Storage Temperature: 15~28°C; Humidity < 80%RH

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