F0448 Datasheet

X0008129 Rev.1.4

Feb 17, 2021

Page 13

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Input 1dB Compression [4]

IP1dB

Full attenuation

25.5

dBm

Output 1dB Compression

OP1dB

17.5

dBm

Reverse Isolation

REVISO

21.5

dB

Channel Isolation [5]

CHISO

49

dB

Over voltage and temperature

48

Stability K factor

KFACT

Over entire temperature range

Up to 9GHz, VCC = 4.75V to 5.25V

1

unit

1.

Specifications in the minimum/maximum columns that are shown in bold italics are guaranteed by test. Specifications in these

columns that are not shown in bold italics are guaranteed by design characterization.

2.

During standby mode, SPI is to be left ON and previous state is maintained when device is powered up.

3.

Including frequency and ripple variations valid within each individual 3GPP band.

4.

Input 1dB compression point is a linearity figure of merit. For maximum RF input power, see Absolute Maximum Ratings.

5.

Signal applied to RFIN_A (RFIN_B), measure desired signal at RFOUT_A (RFOUT_B) and compare to signal level at

RFOUT_B (RFOUT_A). Maximum gain setting.

2.5

Thermal Characteristics

Table 5. Package Thermal Characteristics

Parameter

Symbol

Value

Unit

Junction to Ambient Thermal Resistance.

θ

JA

37.1

°C/W

Junction to Case Thermal Resistance.

(Case is defined as the exposed paddle)

θ

JC-BOT

9.1

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1