4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

−0.5

6

V

IIK

Input diode current

VI < -0.5V or VI > VCC + 0.5V

± 20

mA

IOK

Output diode current

VO < -0.5V or VO > VCC + 0.5V

± 50

mA

IO

Output source or sink current per output pin

VO > -0.5V or VO < VCC + 0.5V

± 50

mA

IOK (2)

VCC or ground current

ICC or IGND

± 100

mA

Tstg

Storage temperature

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For up to 4 outputs per device, add ±25mA for each additional output.

4.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

CDx4AC245

CDx4ACT245

UNIT

MIN

MAX

MIN

MAX

VCC

Supply voltage(1)

1.5V

5.5V

4.5V

5.5V

V

VI, VO

Input or Output Voltage

0V

VCC

0V

VCC

V

dt/dv

Input Rise and Fall Slew Rate

1.5V to 3V

50

ns

3.6V to 5.5V

20

4.5V to 5.5V

10

TA

Temperature range

–55

125

–55

125

°C

(1)

Unless otherwise specified, all voltages are referenced to ground.

4.3 Thermal Information

THERMAL METRIC(1)

CDx4AC14/ CDx4ACT14

UNIT

N (PDIP)

DW (SOIC)

DB (SSOP)

20 PINS

RθJA

Junction-to-ambient thermal resistance

69

98.6

105.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

CD54AC245, CD74AC245, CD54ACT245, CD74ACT245

SCHS245D – NOVEMBER 1998 – REVISED APRIL 2024

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