4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

DC Supply Voltage

-0.5

6

V

IIK

DC Input Diode Current

For VI < -0.5V or VI > VCC +

0.5V

±20

mA

IOK

DC Output Diode Current

For VO < -0.5V or VO > VCC +

0.5V

±50

mA

IO

DC Output Source or Sink Current per

Output Pin

For VO > -0.5V or VO < VCC +

0.5V

±50

mA

ICC or IGND (2) DC VCC or Ground Current

±100

mA

TJ

Junction temperature (Plastic

Package)

150

°C

Tstg

Storage temperature

-65

150

°C

(1)

Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating

and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not

implied.

(2)

For up to 4 outputs per device, add ±25mA for each additional output.

4.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001((1)

±2000

V

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC (1)

Supply Voltage Range

AC Types

1.5

5.5

V

ACT Types

4.5

5.5

VI, VO

DC Input or Output Voltage

0

VCC

V

dt/dv

Input Rise and Fall Slew Rate

AC Types, 1.5V to 3V

±50

ns (Max)

AC Types, 3.6V to 5.5V

±20

ACT Types, 4.5V to 5.5V

±10

TA

Temperature Range

-55

125

°C

(1)

Unless otherwise specified, all voltages are referenced to ground.

4.4 Thermal Information

THERMAL METRIC(1)

D (SOIC)

N (PDIP)

UNIT

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

73

67

°C/W

(1)

The package thermal impedance is calculated in accordance with JESD 51.

CD54AC283, CD74AC283, CD54ACT283, CD74ACT283

SCHS251E – NOVEMBER 1998 – REVISED JANUARY 2025

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