LTC2917/LTC2918

15

29178f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

2.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

0.64

± 0.05

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

2.39

±0.05

(2 SIDES)

3.00

±0.10

(2 SIDES)

1

5

10

6

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0 – 0.05

(DDB10) DFN 0905 REV Ø

0.25

± 0.05

2.39

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.64

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

PIN 1

R = 0.20 OR

0.25

× 45°

CHAMFER

0.50 BSC

MSOP (MS) 0307 REV E

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

12 3 45

4.90

± 0.152

(.193

± .006)

0.497

± 0.076

(.0196

± .003)

REF

8

9

10

7 6

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305

± 0.038

(.0120

± .0015)

TYP

0.50

(.0197)

BSC

0.1016

± 0.0508

(.004

± .002)

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661)

DDB Package

10-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1722 Rev Ø)