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Physical Specification

4.1 Package Description

STCC4 consists of a metal cap LGA package. The sensor opening is protected by a membrane on the metal

cap. The protective membrane must not be removed or tampered with. Sensors must be treated according to

Moisture Sensitivity Level 1 (MSL1) as per IPC/JEDEC J-STD-033D15. It is recommended to process the sensors

within one year after delivery date.

4.2 Package Outline

The STCC4 package outline with nominal dimensions and tolerances can be seen in Figure 3.

Figure 3. Package outline drawing. All dimensions in millimeters.

4.3 Land Pattern

The recommended land pattern for STCC4 can be seen in Figure 4. Pin 1 is denoted by a chamfered edge. Pads

on PCB are recommended to be non-solder mask defined (NSMD). The exact mask geometries, distances and

stencil thicknesses must be adapted to the required soldering processes.

Figure 4. Recommended land pattern. All dimensions in millimeters.

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IPC/JEDEC J-STD-033D, April 2018