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INA131AP bảng dữ liệu(PDF) 3 Page - Texas Instruments

tên linh kiện INA131AP
Giải thích chi tiết về linh kiện  Precision G = 100 INSTRUMENTATION AMPLIFIER
PDF  13 Pages
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nhà sản xuất  TI2 [Texas Instruments]
Trang chủ  https://www.ti.com
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INA131AP bảng dữ liệu(HTML) 3 Page - Texas Instruments

  INA131AP Datasheet HTML 1Page - Texas Instruments INA131AP Datasheet HTML 2Page - Texas Instruments INA131AP Datasheet HTML 3Page - Texas Instruments INA131AP Datasheet HTML 4Page - Texas Instruments INA131AP Datasheet HTML 5Page - Texas Instruments INA131AP Datasheet HTML 6Page - Texas Instruments INA131AP Datasheet HTML 7Page - Texas Instruments INA131AP Datasheet HTML 8Page - Texas Instruments INA131AP Datasheet HTML 9Page - Texas Instruments Next Button
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®
INA131
3
PIN CONFIGURATION
Top View
P-Package/8-Pin DIP
R
G
V
–
IN
V
+
IN
V–
R
G
V+
V
O
Ref
1
2
3
4
8
7
6
5
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
TEMPERATURE
PRODUCT
PACKAGE
NUMBER(1)
RANGE
INA131AP
8-Pin Plastic DIP
006
–40
°C to +85°C
INA131BP
8-Pin Plastic DIP
006
–40
°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
Supply Voltage ..................................................................................
±18V
Input Voltage Range ..........................................................................
±40V
Output Short Circuit (to ground) .............................................. Continuous
Operating Temperature .................................................. –40
°C to +125°C
Storage Temperature ..................................................... –40
°C to +125°C
Junction Temperature .................................................................... +150
°C
Lead Temperature (soldering –10s) .............................................. +300
°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.



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