Pad Dimensions (x,y mm)

P

90 °C, 70um (W)

P

90 °C, 35um (W)

60, 45

5.8

4.6

50, 45

5.4

4.3

40, 40

4.2

4.1

30, 30

3.5

2.8

20, 20

2.9

2.7

10, 10

2.4

2.5

8W Current Sense

Chip Resistors

BCS 8 Series

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General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

© TT electronics plc

02.12

Frequency Characteristics

Temperature Rise

TCR Curves (Dotted line: typical measurement) Recommended Foot Print (mm)

Soldering Recommendation

Custom designs

Due to the enhanced heat dissipation properties of the BCS8, the temperature profile during reflow soldering will need to be increased

by: 10 to 20°C.

Alternative widths and lengths are available, please contact factory for details.

Notes: Characterisation carried out using 70µm and 35µm PCB copper pad weights, with the temperature of 90°C used as a maximum reference

on the PCB.

X mm

Y mm

FR4 Thermal PCB Characterisation

Impedance(Ω)

0.050

0.010

0.005

0.001

10k

100k

1M

10M

Frequency(Hz)

+4000

Slope of +30ppm/°C

+2000

0

-2000

Slope of –30ppm/°C

-4000

//

-50

0

25

50

75

100

125

Resistor Temperature (°C)

7.4

2.5

2.5

9.0

BCS 8

Temperature (°C) at hot spot.

BCS8-R001F

250

200

150

100

50

0

0

2 .0

4.0

6 .0

8.0

1 0.0

Applied Power (W)

(10.2 for 0.5mohm)

OBSOLETE