BCN 4D

BCN 16 4A, AB

Wave Solder Process

Re-flow Solder Process

P

A

B

C

X

Y

A

B

C

X

Y

.050

.087

.169

.022

.028

.041

.087

.154

.022

.028

.034

1.27

2.20

4.30

0.57

0.70

1.05

2.20

3.90

0.57

0.70

0.85

.032

.039

.118

.014

.018

.039

.039

.118

.014

.018

.039

0.80

1.00

3.00

0.35

0.45

1.00

1.00

3.00

0.35

0.45

1.00

BI Technologies IRC Welwyn

Solder pad layout (Inch / mm)

Wave Solder Process

Re-flow Solder Process

P

A

B

X

X1

Y

A

B

X

X1

Y

BCN 16 8RB / 8SB

.025

.048

.096

.012

.018

.024

.048

.096

.012

.018

.024

0.64

1.20

2.40

0.30

0.45

0.60

1.20

2.40

0.30

0.45

0.60

BCN 16 8RB / 8SB

Y

Y

B

A

P

X

X1

BCN Series

03.21

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors

Thick Film Chip Arrays

A

B

Y

Y

X

C

P

BCN4D, BCN164

BCN168

OBSOLETE (BCN4D only)