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Custom versions available upon request.

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Specifications subject to change without notice

HCLC Series Feb 29 2024

HCLC Series Datasheet

RoHS

Compliant

RECOMMENDED WAVE SOLDERING CONDITIONS

°C

s

250

200

150

100

50

260 °C max

TΔ = 183 °C

10 s max

2 ~ 4 °C/s

2 ~ 3 °C/s

• Note

Product soldering processing conditions and set methods may vary due to differences between various manufactures and

their equipment. Adjustments are to be made accordingly.

PACKAGING SPECIFICATIONS

350 mm

C/NO.

LAB

EL

LABEL

Customer P/O:

Customer Part No:

Supplier Part No:

Lot No:

Quantity: Pcs

N. W.:

kg

G. W.:

kg

Series

Packaging Quantity (pcs)

per Tray

Trays per Carton

Total Quantity per Carton

HCLC

70

7

490