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CDCS503 bảng dữ liệu(PDF) 3 Page - Texas Instruments

tên linh kiện CDCS503
Giải thích chi tiết về linh kiện  Clock Buffer/Clock Multiplier With Optional SSC
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CDCS503 bảng dữ liệu(HTML) 3 Page - Texas Instruments

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CDCS503-Q1
IN
SSC_SEL 0
SSC_SEL 1
GND
VDD
OE
OUT
FS
CDCS503-Q1
www.ti.com
SCAS924B – MARCH 2012 – REVISED JUNE 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION
PACKAGE
PIN FUNCTIONS
SIGNAL
PIN
TYPE
DESCRIPTION
IN
1
I
LVCMOS clock input
OUT
6
O
LVCMOS clock output
SSC_SEL 0, 1
2, 3
I
Spread selection pins, internal pullup
OE
7
I
Output enable, internal pullup
FS
5
I
Frequency multiplication selection, internal pullup
VDD
8
Power
3.3-V power supply
GND
4
Ground
Ground
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 105°C
TSSOP
2000
CDCS503TPWRQ1
CS503Q
PACKAGE THERMAL RESISTANCE FOR TSSOP (PW) PACKAGE
over operating free-air temperature range (unless otherwise noted)
(1)
THERMAL AIRFLOW (CFM)
PW 8-PIN TSSOP
UNIT
0
150
250
500
High K
149
142
138
132
RθJA
°C/W
Low K
230
185
170
150
High K
65
RθJC
°C/W
Low K
69
(1)
The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
THERMAL INFORMATION
CDCS503TPWRQ1
THERMAL METRIC(1)
UNIT
PW (8 PINS)
θJA
Junction-to-ambient thermal resistance
179.9
θJCtop
Junction-to-case (top) thermal resistance
64.9
θJB
Junction-to-board thermal resistance
108.7
°C/W
ψJT
Junction-to-top characterization parameter
9
ψJB
Junction-to-board characterization parameter
107
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2012, Texas Instruments Incorporated
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Product Folder Link(s): CDCS503-Q1



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