RI-27 SMD Series Dry Reed Switch

Through-hole Reed Switches

The attachment method is typically eutectic soldering.

RoHS requires solder with no elemental lead (Pb). SAC

alloy (96,5Sn / 3AG / 0,5Cu) is the most popular choice.

Reed switches can be soldered by hand or by wave sol-

der processing. Comus Technology recommends the

maximum wave solder temperature (measured at the reed

switch leads) as 270°C for 10 seconds. Temperature and

time in excess of the recommended levels may result in

damage to the reed switch. All of our through-hole reed

switches will be compatible with either SAC alloy or

eutectic soldering process.

Surface Mounted Reed Switches

The most common method of attachment is by SMD

processing - stencil/screen solder paste, then oven reflow.

Due to board thickness, component density, and other

circumstances that dictate the required reflow temperature,

Comus Technology uses a higher temperature solder for all

internal connections. We recommend that the temperature

(measured at the reed switch leads) does not exceed 260°C

for 1 minute. Temperature and time in excess of the rec-

ommended levels may result in damage to the reed switch.

Handling Force

When possible don’t add pressure on the glass on placing

the reed switch on a pcb or device. However when han-

dling with a Pick and Place machine the acceptable force

on the reed switch is 3N with a max of 5N.

• As part of the company policy of continued product improvement, specifications

may change without notice. Our sales office will be pleased to help you with the

latest information on this product range and the details of our full design and

manufacturing service. All products are supplied to our standard conditions of

sale unless otherwise agreed in writing.

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Recommended Soldering Reflow Profile

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