LTM4682 datasheet(4/130 Pages) AD

4 / 130 page

LTM4682

Rev. A

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Terminal Voltages

VINnn (Note 4), SVIN_nn, IIN_nn+, IIN_nn−,

VIN_VBIAS, RUNP ........................................ –0.3V to 18V

(SVIN_nn – IIN_nn+), (IIN_nn+ – IIN_nn−) ....... –0.3V to 0.3V

SWn ............................ −1V to 18V, −5V to 18V Transient

INTVCC_nn, VBIAS ......................................... –0.3V to 6V

VOUTn ........................................................ –0.3V to 2.0V

VOSNSn+..................................................... –0.3V to 2.0V

VOSNSn−..................................................... –0.3V to 0.3V

RUNn, SDA_nn, SCL_nn, ALERT_nn ......... –0.3V to 5.5V

FSWPH_nn_CFG, VOUTn_CFG,

VTRIMn_CFG, ASEL_nn.......................... –0.3V to 2.75V

FAULTn, SYNC_nn, SHARE_CLK_nn,

WP_nn, PGOODn ...................................... −0.3V to 3.6V

COMPna, COMPnb.................................... –0.3V to 2.7V

TSNSn....................................................... –0.3V to 0.8V

n = 0, 1, 2, 3 and nn = 01, 23

VDD33_nn and VDD25_nn Are Outputs Not to Be Driven.

Temperatures

Internal Operating Temperature Range

(Notes 2, 15, 16) .................................... –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Package Body Temperature... 245°C

(Note 1)

9 10 11 12 13 14

VOUT0

GND

TOP VIEW

BGA PACKAGE

330-PIN (15mm × 22mm × 5.71mm)

TJMAX = 125°C, θJCtop = 2.8°C/W, θJCbottom = 1.4°C/W, θJA = 4.4°C/W

VOUT1

VOUT2

VOUT3

SW0

SW1

SW3

VIN23

VIN01

SW2

SHARE_CLK_01

VTRIM0_CFG

VDD25_01 VTRIM1_CFG

VIN_VBIAS

COMP1b

VDD33_01

VOSNS1–

COMP1a

VOSNS1+

VOSNS2+

INTVCC_01

SVIN_01

SCL_23

ALERT_23

RUN3

SYNC_23

SDA_23

PGOOD0

PGOOD1

COMP2b

COMP2a

RUNP

ALERT_01

SYNC_01

TSNS0

TSNS1

TSNS3

SVIN_23

INTVCC_23

COMP0b

COMP0a

IN_01+

VOSNS0–

IN_01–

IN_23–

VOSNS2–

TSNS2

IN_23+

VOSNS0+

PGOOD2

VOSNS3+

PGOOD3 VOSNS3

–

FAULT2

COMP3a

FAULT3

COMP3b

VDD33_23

WP_23

VBIAS

SGND_01

SGND_23

RUN2

SDA_01

SCL_01

WP_01

θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT = 6.4g (TYP.).

θJA VALUE IS OBTAINED WITH DEMO BOARD.

SEE THE APPLICATIONS INFORMATION SECTION FOR LAB MEASUREMENT AND DERATING INFORMATION.

ORDER INFORMATION

PART NUMBER

PAD OR BALL

FINISH*

PART MARKING

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4682EY#PBF

SAC305 (RoHS)

LTM4682Y

BGA

–40°C to 125°C

LTM4682IY#PBF

SAC305 (RoHS)

LTM4682Y

BGA

–40°C to 125°C

LTM4682IY

SnPb (63/37)

LTM4682Y

BGA

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

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