SSC3H40H

Taiwan Semiconductor

2

Version: A2504

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

RӨJL

15

°C/W

Junction-to-ambient thermal resistance

RӨJA

58

°C/W

Junction-to-case thermal resistance

RӨJC

16

°C/W

Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage(1)

IF = 1.5A, TJ = 25°C

VF

0.52

-

V

IF = 3.0A, TJ = 25°C

0.56

0.60

V

IF = 1.5A, TJ = 125°C

0.40

-

V

IF = 3.0A, TJ = 125°C

0.48

0.51

V

Reverse current @ rated VR(2)

TJ = 25°C

IR

-

30

μA

TJ = 125°C

-

5

mA

Junction capacitance

1MHz, VR = 4.0V

CJ

184

-

pF

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

SSC3H40H

DO-214AB (SMC)

3,000 / Tape & Reel