TDA7528

Package informations

3/5

Package informations

These packages have a Lead-free second level interconnect. The category of second level

Interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 1.

LQFP64 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.60

0.063

A1

0.05

0.15

0.002

0.006

A2

1.35

1.40

1.45

0.053

0.055

0.057

B

0.17

0.22

0.27

0.0066 0.0086 0.0086

C

0.09

0.20

0.0035

0.0079

D

11.80

12.00

12.20

0.464

0.472

0.480

D1

9.80

10.00

10.20

0.386

0.394

0.401

D3

7.50

0.295

e

0.50

0.0197

E

11.80

12.00

12.20

0.464

0.472

0.480

E1

9.80

10.00

10.20

0.386

0.394

0.401

E3

7.50

0.295

L

0.45

0.60

0.75

0.0177 0.0236 0.0295

L1

1.00

0.0393

K

0˚ (min.), 3.5˚ (min.), 7˚(max.)

ccc

0.080

0.0031

LQFP64 (10 x 10 x 1.4mm)

Exposed Pad Down

7278841 C