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ADL6331ACCZA-R7 bảng dữ liệu(PDF) 35 Page - Analog Devices |
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ADL6331ACCZA-R7 bảng dữ liệu(HTML) 35 Page - Analog Devices |
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35 / 54 page ![]() Data Sheet ADL6331 BASIC CONNECTIONS analog.com Rev. B | 35 of 54 Figure 95. Basic Connections Table 18. Basic Connections Functional Blocks Pin No. Mnemonic Description Basic Connection Chip Address Selection 1, 23, 24 CA2, CA1, CA0 SPI chip address selects Chip address selection. Ground 2, 5, 14, 16, 17 GND Ground Connect the GND pins to the ground of the PCB. RF Input 3, 4 RFINP, RFINN RF differential input 50 Ω differential input. AC-coupled is al- ways recommended. Preprogrammed Mode 6, 13 ATTSEL1, ATTSEL0 Preprogrammed mode selection MUXOUT 7 MUXOUT Analog voltage output from the tempera- ture sensor Voltage measurement pin for reading chip temperature. Leave as no connect when not in use. 3.3 V 8 to 11 V33AMP1A, V33AMP1, V33AMP2A, V33AMP2 Amplifier, analog supply voltage Decouple Pin 8 to Pin 11 via 220 pF, 0.1 µF capacitors to ground. Ensure that the decoupling capacitors are located close to the pins. Device Enable 12 ENP Active-high for normal operation Decouple Pin 22 via 220 pF, 0.1 µF capaci- tors to ground. Ensure that the decoupling capacitors are located close to the pin. RF Output 15 RFOUT RF single-ended output 50 Ω single-ended output. AC-coupled is always recommended. Serial Port 18 SDO SPI data input 1.8 V to 3.3 V tolerant logic levels. 19 SDIO SPI date input and output 1.8 V to 3.3 V tolerant logic levels. 20 SCLK SPI clock 1.8 V to 3.3 V tolerant logic levels. 21 CSB Active-low chip select 1.8 V to 3.3 V tolerant logic levels. 3.3 V 22 V33FUSE Digital, DSA, and other bias voltage EPAD Exposed pad Exposed pad Exposed pad Exposed Pad. The exposed pad must be connected to ground for electrical and ther- mal purposes. |
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