Data Sheet

ADPL42005

analog.com

Rev. 0

7 of 26

resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path

as in thermal resistance, θJB. Therefore, ΨJB thermal paths include convection from the top of the package as well as

radiation from the package, factors that make ΨJB more useful in real-world applications. The maximum junction

temperature (TJ ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula:

TJ = TB + (PD × ψJB) (2)

Refer to JESD51-8 and JESD51-12 for more detailed information about ΨJB.

Thermal Resistance

θJA and ΨJB are specified for the worst case conditions, that is, a device soldered in a circuit board for surface-mount

packages. θJC is a parameter for surface-mount packages with top mounted heat sinks. θJC is presented here for

reference only.

Table 4. Thermal Resistance

Package Type

θJA

θJC

ΨJB

Unit

8-Lead LFCSP

40.1

27.1

17.2

°C/W

8-Lead SOIC

48.5

58.4

31.3

°C/W

ESD Caution

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features patented or proprietary

protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,

proper ESD precautions should be taken to avoid performance degradation or loss of

functionality.