PE2BB

– PE2DB

Taiwan Semiconductor

2

Version: A2301

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

RӨJL

18

°C/W

Junction-to-ambient thermal resistance

RӨJA

67

°C/W

Junction-to-case thermal resistance

RӨJC

19

°C/W

Thermal Performance Note: Units mounted on PCB (10mm x 10mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (T

A = 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX UNIT

Forward voltage

(1)

IF = 1A, TJ = 25°C

VF

0.81

-

V

IF = 2A, TJ = 25°C

0.87

0.90

V

IF = 1A, TJ = 125°C

0.65

-

V

IF = 2A, TJ = 125°C

0.72

-

V

Reverse current @ rated VR

(2)

TJ = 25°C

IR

-

2

µA

TJ = 125°C

-

10

µA

Junction capacitance

1MHz, VR = 4.0V

CJ

30

-

pF

Reverse recovery time

IF = 0.5A, IR = 1.0A, Irr = 0.25A

trr

-

20

ns

IF = 1.0A, di/dt = 50A/µs, VR = 30V

24

-

Reverse recovery current

IF = 2.0A, di/dt = 200A/µs, VR = 100V

IRM

2.7

-

A

Reverse recovery charge

Qrr

17.4

-

nC

Reverse recovery time

trr

14

-

ns

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE(1)

PACKAGE

PACKING

PE2xB

DO-214AA (SMB)

3,000/ Tape & Reel

Notes:

1.

“x” defines voltage from 100V(PE2BB) to 200V(PE2DB)