CMS09 datasheet(3/5 Pages) TOSHIBA

3 / 5 page

CMS09

2006-11-13

0.5

0.001

0.01

0.1

100

1000

100

500

Device mounted on a glass-epoxy board

Soldering land: 2.1 mm

× 1.4 mm

Device mounted on a glass-epoxy board

Soldering land: 6.0 mm

× 6.0 mm

Device mounted on a ceramic board

Soldering land: 2.0 mm

× 2.0 mm

Instantaneous forward voltage vF (V)

Average forward current IF (AV) (A)

iF – vF

PF (AV) – IF (AV)

Ta max – IF (AV)

Device mounted on a glass-epoxy board

(board size: 50 mm

× 50 mm, land size 6 mm × 6 mm)

Ta max – IF (AV)

Device mounted on a ceramic board

(board size: 50 mm

× 50 mm)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

75°C

125°C

25°C

Tj = 150°C

0.9

160

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

100

120

α = 180°

α = 120°

α = 60°

360°

0°

Rectangular

waveform

Conduction angle:

IF (AV)

VR = 15 V

140

160

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

100

120

α = 180°

α = 120°

α = 60°

360°

0°

Rectangular

waveform

Conduction angle:

IF (AV)

VR = 15 V

140

0.2

0.6

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.1

0.3

0.4

α = 180°

α = 120°

α = 60°

0.5

360°

0°

Rectangular

waveform

Conduction angle:

Time t (s)

rth (j-a) – t

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