Data Sheet

LTM8060F

analog.com

Rev. 0

41 of 43

ORDERING GUIDE

Table 12.Ordering Guide

MODEL

TEMPERATURE

RANGE1

PACKAGE DESCRIPTION

PACKAGE OPTION

LTM8060FEV#PBF

–40°C to 125°C LTM8060FV part marking

SAC305 (RoHS) pad finish*

E1 finish code

Moisture sensitivity level 4 (MSL 4) rated device

165-Pin, 16mm × 11.9mm ×

2.9mm, Pre-Soldered Grid

Array (PSGA)

LTM8060FIV#PBF

–40°C to 125°C LTM8060FV part marking

SAC305 (RoHS) pad finish

E1 finish code

Moisture sensitivity level 4 (MSL 4) rated device

165-Pin, 16mm × 11.9mm ×

2.9mm, Pre-Soldered Grid

Array (PSGA)

1 The LTM8060FE is guaranteed to meet performance specifications from 0°C to 125°C internal. Specifications over the full –

40°C to 125°C internal operating temperature range are assured by design, characterization, and correlation with statistical

process controls. The LTM8060FI is guaranteed to meet specifications over the full –40°C to 125°C internal operating

temperature range. Note that the maximum internal temperature is determined by specific operating conditions in

conjunction with board layout, the rated package thermal resistance, and other environmental factors.

Contact the factory for parts specified with wider operating temperature ranges. *Pad finish code is per IPC/JEDEC

J-STD-609. The device temperature grade is indicated by a label on the shipping container.This product is not

recommended for second side reflow. This product is moisture sensitive. For more information, go to

Recommended LGA and BGA PCB assembly and manufacturing procedures. The PSGA package should follow BGA

assembly and manufacturing procedures.

LGA and BGA package and tray drawings.

Table 13.Evaluation Board

PART NUMBER

DESCRIPTION

DC2820A-B

40VIN quad 3A Silent Switcher µModule regulator with EMI shield.