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Rev.2.1 Oct.04, 2019

AX3050/A



ABSOLUTE MAXIMUM RATINGS (at TA = 25°C)

Characteristics

Symbol

Rating

Unit

IN to GND

-0.3 to 40

V

LX to GND

-1 to VIN + 1

V

BS to GND

VLX - 0.3 to VLX + 7

V

FB, SENSE1, SENSE2, COMP to GND

-0.3 to + 6

V

Operating Junction Temperature

-40 to 150

°C

Storage Junction Temperature

-65 to 150

°C

Lead Temperature (Soldering 10 sec.)

300

°C

Thermal Resistance from Junction to case

θJC

15

°C/W

Thermal Resistance from Junction to ambient

θJA

75

°C/W

Note : θJA is measured with the PCB copper are (need connect to Exposed pad) of approximately 1

in2(Multi-layer).



ELECTRICAL CHARACTERISTICS

(VIN=12V, TA=25°C, unless otherwise specified)

Characteristics

Symbol

Conditions

Min Typ Max Units

Input Voltage

8

-

34

V

OVP detect voltage

VOVP Internal define

-

5.8

-

V

OVP Hysteresis

-

0.3

-

V

Quiescent Current

ICCQ VFB = 1.5V, force driver off.

-

2

-

mA

Standby Supply Current

V0 = 5V, No Load

-

10

15

mA

Line compensation Current

IFB

VSENSE1-VSENSE2=100mV

3.5

5

6.5

uA

Feedback Voltage

0.98

1

1.02

V

High-Side Switch On

Resistance

RDSON VIN=12V, IOUT = 1A

-

150 200 mΩ

Low-Side Switch On

Resistance

RDSON VIN=12V

-

5

-

Ω

Switching Frequency

FOSC

AX3050; IOUT=200mA

80

100 120 KHz

AX3050A; IOUT=200mA

200 250 300 KHz

Maximum Duty Cycle

AX3050

90

93

-

%

AX3050A

87

90

-

%

Minimum On-Time

-

150

-

ns

Secondary Cycle-by-Cycle

Current Limit

Minimum Duty Cycle, no CC

-

2.4

-

A

Reference Voltage of the

Short Circuit Fold back

Comparator

VSCP

-

0.4 0.45

V

Sense Voltage (Bin2)

VSENSE VSENSE1-VSENSE2

95

100 105 mV

Sense Voltage (Bin3)

VSENSE VSENSE1-VSENSE2

85

100 115 mV

Thermal shutdown Temp

TSD

-

140

-

°C

Thermal Shutdown

Hysteresis

TSH

-

30

-

°C