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CD4070B bảng dữ liệu(PDF) 1 Page - Silicon Supplies |
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CD4070B bảng dữ liệu(HTML) 1 Page - Silicon Supplies |
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1 / 5 page ![]() CMOS High Voltage Logic – CD4070B Quadruple Exclusive-OR Gate Logic IC in bare die form Die Size (Unsawn) 1900 x 1850 75 x 73 µm mils Minimum Bond Pad Size 106 x 106 4.17 x 4.17 µm mils Die Thickness 350 (±20) 13.78 (±0.79) µm mils Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si High Input Voltage up to 20V Noise immunity greater than 50% All outputs buffered Drives x2 Low-Power TTL loads or x1 LSTTL load Symmetrical Sink & Source Currents Direct drop-in replacement for obsolete components in long term programs. Rev 1.0 15/03/18 Description Features: The CD4070B Quad Exclusive OR Gate is fabricated using a 3µm 15CMOS process. This device consists of four independent Exclusive OR gates and performs the Boolean functions Y = A ⊕ B = AB + AB in positive logic. The device has equal source and sink current capabilities and conforms to standard B series output drive. Inputs are protected against ESD and voltage transients by diode clamps to VDD and VSS. Ordering Information Die Dimensions in µm (mils) 1900 (75) The following part suffixes apply: No suffix - MIL-STD-883 /2010B Visual Inspection “H” - MIL-STD-883 /2010B Visual Inspection + MIL-PRF-38534 Class H LAT “K” - MIL-STD-883 /2010A Visual Inspection (Space) + MIL-PRF-38534 Class K LAT LAT = Lot Acceptance Test. For further information on LAT process flows see below. www.siliconsupplies.com\quality\bare-die-lot-qualification Supply Formats: Mechanical Specification Default – Die in Waffle Pack (100 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request Die Thickness <> 350µm(14 Mils) – On request Assembled into Ceramic Package – On request Page 1 of 5 www.siliconsupplies.com |
Số phần tương tự - CD4070B |
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Mô tả tương tự - CD4070B |
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