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CPC1708 bảng dữ liệu(PDF) 1 Page - Clare, Inc. |
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CPC1708 bảng dữ liệu(HTML) 1 Page - Clare, Inc. |
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1 / 6 page ![]() www.clare.com DS-CPC1708-R01 1 CPC1708 i4-PAC™ DC Power Relay e3 RoHS 2002/95/EC Part # Description CPC1708J i4-PAC (25 per tube) Parameters Ratings Units Blocking Voltage 60 V P Load Current, T A=25ºC 11.85 With 5°C/W Heat Sink A DC No Heat Sink 4 On-resistance 0.08 Ω RθJC 0.35 ºC/W Applications Features Description Ordering Information Pin Configuration • Industrial Controls • Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Utility Meters (gas, oil, electric and water) • Transportation Equipment • Aerospace/Defense • 100% Solid State • Compact i4-PAC Power Package • Low Thermal Resistance (0.35°C/W) • 11.85A DC Load Current with 5ºC/W Heat Sink • Electrically Non-conductive Thermal Pad for Heat Sink Applications • Arc-Free With No Snubbing Circuits • 2500V rms Input/Output Isolation • No EMI/RFI Generation • Machine Insertable, Wave Solderable Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1708 1-Form-A DC Solid State Relay employs optically coupled MOSFET technology to provide 2500V rms of input to output isolation. The output is constructed with an efficient MOSFET switch and photovoltaic die that use Clare’s patented OptoMOS architecture while the input GaAlAs infrared LED provides the optically-coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique i4-PAC package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500V rms isolation but also very low thermal resistance (0.35°C/W). 12 3 4 +- - + Switching Characteristics of Normally Open (Form A) Devices CONTROL I LOAD 10% 90% TON TOFF + + Approvals • UL recognized component: File # E69938 • Certified to UL 508 |
Số phần tương tự - CPC1708 |
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Mô tả tương tự - CPC1708 |
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