STA2062 datasheet(3/5 Pages) STMICROELECTRONICS

tên linh kiện	STA2062

Giải thích chi tiết về linh kiện	Cartesio??Infotainment application processor with embedded GPS

PDF	5 Pages

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nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

Trang chủ	http://www.st.com

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STA2062

Package information

3/5

Package information

In order to meet environmental requirements, ST offers this device in ECOPACK® packages.

This package has a Lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

LFBGA361 (16x16x1.4mm) mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.400

0.0551

0.210

0.0082

0.985

0.0387

0.200

0.0079

0.800

0.0315

0.350

0.400

0.450 0.0138 0.0157 0.0177

15.850 16.000 16.150 0.6240 0.6299 0.6358

14.400

0.5669

15.850 16.000 16.150 0.6240 0.6299 0.6358

14.400

0.5669

0.800

0.0315

0.800

0.0315

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.080

0.0031

LFBGA361

Low profile Fine Pitch Ball Grid Array

Body: 16 x 16 x 1.4mm

8033008 B

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