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3 / 49 page ![]() PCAL6408A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 18 September 2013 3 of 49 NXP Semiconductors PCAL6408A Low-voltage translating, 8-bit I2C-bus/SMBus I/O expander ESD protection exceeds JESD 22 2000 V Human-Body Model (A114-A) 1000 V Charged-Device Model (C101) Packages offered: HVQFN16, TSSOP16, XQFN16, XFBGA16 (1.6 mm 1.6 mm 0.5 mm) 2.1 Agile I/O features Software backward compatible with PCA6408A with interrupts disabled at power-up Pin-to-pin drop-in replacement for PCA6408A Output port configuration: bank selectable push-pull or open-drain output stages Interrupt status: read-only register identifies the source of an interrupt Bit-wise I/O programming features: Output drive strength: four programmable drive strengths to reduce rise and fall times in low-capacitance applications Input latch: Input Port register values changes are kept until the Input Port register is read Pull-up/pull-down enable: floating input or pull-up/pull-down resistor enable Pull-up/pull-down selection: 100 k pull-up/pull-down resistor selection Interrupt mask: mask prevents the generation of the interrupt when input changes state to prevent spurious interrupts 3. Ordering information Table 1. Ordering information Type number Topside marking Package Name Description Version PCAL6408ABS L8A HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 3 0.85 mm SOT758-1 PCAL6408APW PL6408A TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 PCAL6408AHK L8 XQFN16 plastic, extremely thin quad flat package; no leads; 16 terminals; body 1.80 2.60 0.50 mm SOT1161-1 PCAL6408AEX L8 XFBGA16 plastic, extremely thin fine-pitch ball grid array package; 16 balls; body 1.6 1.6 0.5 mm SOT1354-1 |
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