Drawings

Diagram

t

Liquidus

≤8min. 25°C to Peak

≤30s

T

Peak-5°C

≤260°C

Preheat

Peak

t [s]

T

Peak

T

Liquidus

T

Preheat max

T

Preheat min

Classification reflow soldering profile

Circuit diagram

1CT:1CT

P6

P7

P3

P2

P4

J1

J2

J3

J6

CAP 1000pF 2KV

75Ω

75Ω

75Ω

1CT:1CT

75Ω

P1

SHIELD

J4

J5

J7

J8

ELECTRONICAL SPECIFICATIONS

1. ACCORDING TO IEEE 802.3

2. TURN RATIO @100KHz:

(P1~P2):(J1~J2) = 1:1±5%

(P3~P6):(J3~J6) = 1:1±5%

3. PRIMARY INDUCTANCE:

350μH MIN @100KHz

0,1V 8mA DC BIAS

4. DC RESISTANCE:

1,2 OHMS MAX

5. INSERTION LOSS:

1-100MHz

-1,2dB MAX

6. RETURN LOSS:

1-30MHz

-16dB MIN

30-60MHz

-12dB MIN

60-80MHz

-10dB MIN

7. CROSS TALK:

1-100MHz

-30dB MIN

8. COMMON TO COMMON

MODE ATTENUATION:

1-100MHz

-30dB MIN

9. ISOLATION: PHY SIDE TO LINE SIDE: 1500VAC or 2250VDC

JACK SIDE

PCB SIDE

CUC-IA4M-J1ST-AB/R4R-P - RJ45 PCB connector

1664061

https://www.phoenixcontact.com/us/products/1664061

Jan 15, 2025, 12:26 AM

Page 4 (6)