TDA1175P datasheet(9/13 Pages) STMICROELECTRONICS

tên linh kiện	TDA1175P

Giải thích chi tiết về linh kiện	LOW-NOISE VERTICAL DEFLECTION SYSTEM

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TDA1175P

MOUNTING INSTRUCTION

The Rth (j-a) can be reduced by soldering the GND

pins to a suitable copper area of the printed circuit

board (Figure 11) or to an external heatsink (Fig-

ure 12).

The diagram of Figure 13 shows the maximum dis-

sipable power Ptot and the Rth (j-a) as a function of

the side "I" of two equal square copper areas hav-

ing a thicknessof 35

µ (1.4 mils).

During soldering the pins temperature must not

exceed 260°C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper

area must be connected to electrical ground.

Figure 11. Example of P.C. Board Copper Area

Figure 12. External Heatsink Mounting

Example

Figure 13. Maximum Power Dissipation and

Junction-ambient Thermal Resistance versus

"I"

Figure 14. Maximum Allowable Power

Dissipation versus Ambient Temperature

COPPER AREA 35

µ THICKNESS

P.C. BOARD

S-3181

11.9 mm

S-3474

38.0 mm

17.0 mm

Ptot

(W)

Rth

(˚C/W)

G-3558

l (mm)

Rth j - amb

Ptot (Tamb = 70˚C)

Ptot

-50

100

Tamb(˚C)

G-3559/2

FREE

AIR

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