Notes:

(1) Mounting considerations: The thermal copper pad on bottom of device must be soldered to a solid copper

area, of 1 inch * 1 inch (min.) with multiple vias under the device to achieve specified

θ

(See recommended land pattern).

(2) This limit indicates that the regulator has a current limit threshold that is greater than the rated Minimum

current. The rated current can only be achieved if the Absolute Maximum Junctions temperatures are not

violated. The amount of heatsinking determines the maximum usable VTT current.

r

e

t

e

m

a

r

a

Pl

o

b

m

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t

i

d

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y

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a

Ms

t

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n

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r

a

e

n

i

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D

D

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e

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a

tl

o

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t

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p

t

u

OV

T

U

O

1

R

D

D0

5

4

.

25

.

20

5

5

.

2V

2

R

D

D4

6

7

.

18

.

16

3

8

.

1V

t

n

e

r

r

u

C

t

r

a

t

S

tf

o

SI

S

S

5

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µ

e

g

a

tl

o

V

p

ir

T

t

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e

r

r

u

c

r

e

v

OV

P

I

R

T

0

50

60

7%

h

t

d

i

w

d

n

a

B

r

e

if

il

p

m

A

r

o

r

r

EW

B5

z

H

M

n

o

it

a

l

u

g

e

R

d

a

o

LT

x

a

m

j

C

°

5

2

1

<2

%

n

i

a

G

r

e

if

il

p

m

A

r

o

r

r

EL

O

A5

7b

d

w

o

L

d

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G

r

e

w

o

Pk

n

i

s

A

m

10

50

0

4V

m

e

g

a

k

a

e

L

h

g

i

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d

o

o

G

r

e

w

o

PV

51

.

02

A

µ

O

D

L

Y

B

T

S

t

n

e

r

r

u

C

t

u

p

t

u

O3

S0

5

6A

m

n

o

it

a

l

u

g

e

R

d

a

o

LT

x

a

m

j

C

°

5

2

1

<2

%

O

D

L

T

T

V

s

t

n

e

r

r

u

C

k

n

i

S

d

n

a

e

c

r

u

o

S

)

2

(

I

T

T

8

.

10

.

2A

n

o

it

a

l

u

g

e

R

d

a

o

L

5

.

2%

n

i

a

G

r

e

if

il

p

m

A

r

o

r

r

EG

A

E

5

7b

d

Electrical Characteristics (Cont.)

Unless specified: T

POWER MANAGEMENT

SC2615

3

 2003 Semtech Corp.

www.semtech.com